Maxim Integrated DS3173 Interface Controllers
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DS3173 Tech Specifications
Maxim Integrated DS3173 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 1 Week | |
| Surface Mount | YES | |
| Number of Terminals | 400Terminals | |
| Package Description | 27 X 27 MM, 1.27 MM PITCH, CSBGA-400 | |
| Package Style | GRID ARRAY | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Equivalence Code | BGA400,20X20,50 | |
| Supply Voltage-Nom | 3.3 V | |
| Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Operating Temperature-Max | 70 °C | |
| Rohs Code | No | |
| Manufacturer Part Number | DS3173 | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Manufacturer | Maxim Integrated Products | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MAXIM INTEGRATED PRODUCTS INC | |
| Risk Rank | 5.12 | |
| Part Package Code | BGA | |
| JESD-609 Code | e0 | |
| Pbfree Code | No | |
| ECCN Code | EAR99 | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| HTS Code | 8542.39.00.01 | |
| Subcategory | Other Telecom ICs | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 240 | |
| Number of Functions | 1Function | |
| Terminal Pitch | 1.27 mm | |
| Reach Compliance Code | not_compliant | |
| Pin Count | 400 | |
| JESD-30 Code | S-PBGA-B400 | |
| Qualification Status | Not Qualified | |
| Power Supplies | 3.3 V | |
| Temperature Grade | COMMERCIAL | |
| Supply Current-Max | 0.449 mA | |
| Seated Height-Max | 2.54 mm | |
| Telecom IC Type | FRAMER | |
| Width | 27 mm | |
| Length | 27 mm |
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