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LT5570IDD#PBF Tech Specifications
Linear Technology/Analog Devices LT5570IDD#PBF technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
Lifecycle Status | PRODUCTION (Last Updated: 3 months ago) | |
Factory Lead Time | 8 Weeks | |
Mount | Surface Mount | |
Mounting Type | Surface Mount | |
Package / Case | 10-WFDFN Exposed Pad | |
Number of Pins | 10Pins | |
Packaging | Tube | |
Published | 2007 | |
JESD-609 Code | e3 | |
Part Status | Active | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Number of Terminations | 10Terminations | |
ECCN Code | EAR99 | |
Terminal Finish | Matte Tin (Sn) | |
Max Operating Temperature | 85°C | |
Min Operating Temperature | -40°C | |
HTS Code | 8542.39.00.01 | |
Voltage - Supply | 4.75V~5.25V | |
Terminal Position | DUAL | |
Peak Reflow Temperature (Cel) | 260 | |
Number of Functions | 1Function | |
Supply Voltage | 5V | |
Terminal Pitch | 0.5mm | |
Frequency | 40MHz~2.7GHz | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Base Part Number | LT5570 | |
Pin Count | 10 | |
Temperature Grade | INDUSTRIAL | |
Operating Supply Current | 32.5mA | |
Accuracy | ±0.3dB | |
Telecom IC Type | RF AND BASEBAND CIRCUIT | |
RF Type | Cellular, W-CDMA, TD-SCDMA, WiMax and CDMA2000 | |
Input Range | -52dBm ~ 13dBm | |
Length | 3mm | |
Height Seated (Max) | 0.8mm | |
Radiation Hardening | No | |
RoHS Status | ROHS3 Compliant | |
Lead Free | Lead Free |
LT5570IDD#PBF Documents
Download datasheets and manufacturer documentation for LT5570IDD#PBF
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