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- HGP.1E.650.CTLP
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HGP.1E.650.CTLP Tech Specifications
LEMO HGP.1E.650.CTLP technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Mount | Bulkhead, Panel, Rear Side Nut | |
| Mounting Type | Panel Mount | |
| Mounting Feature | Bulkhead - Rear Side Nut | |
| Dielectric Material | Polytetrafluoroethylene (PTFE) | |
| Body Material | Brass | |
| Center Contact Plating | Gold | |
| Center Contact Material | Beryllium Copper | |
| Contact Finish Mating | NOT SPECIFIED | |
| Contact Materials | Copper | |
| Operating Temperature | -20°C~100°C | |
| Packaging | Bulk | |
| Series | 1E | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Connector Type | Receptacle, Female Socket | |
| Fastening Type | Push-Pull | |
| Ingress Protection | IP68 - Dust Tight, Waterproof | |
| Housing Color | Silver | |
| Impedance | 50Ohm | |
| Connector Style | Triaxial | |
| Mating Cycles | 5000 | |
| Contact Termination | Solder Cup | |
| Includes | 2 pcs - 1 Connector, 1 Nut | |
| Body Finish | Chrome | |
| Cable Group | RG-174, 178, Belden 9222 | |
| Shield Termination | Solder | |
| RoHS Status | ROHS3 Compliant | |
| Ratings | Dust Tight, IP66, Water Resistant, Waterproof |
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