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HGP.00.250.CLAP Tech Specifications

LEMO  HGP.00.250.CLAP technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mount Bulkhead, Panel, Rear Side Nut
Mounting Type Panel Mount
Mounting Feature Bulkhead - Rear Side Nut
Dielectric Material Polyetheretherketone (PEEK)
Body Material Brass
Center Contact Plating Gold
Contact Finish Mating NOT SPECIFIED
Contact Materials NOT SPECIFIED
Voltage Rated 700V
Operating Temperature -20°C~100°C
Packaging Bulk
Series 00
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Connector Type Receptacle, Male Pin
Fastening Type Push-Pull
Ingress Protection IP68 - Dust Tight, Waterproof
Housing Color Silver
Impedance 50Ohm
Connector Style NIM-CAMAC CD/N 549
Mating Cycles 5000
Contact Termination Solder Cup
Includes 3 pcs - 1 Connector, 1 Lockwasher, 1 Nut
Body Finish Chrome
Shield Termination Solder
RoHS Status ROHS3 Compliant
Ratings Dust Tight, IP68, Waterproof
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HGP.00.250.CLAP Documents

Download datasheets and manufacturer documentation for   HGP.00.250.CLAP

HGP.00.250.CLAP brand manufacturers: LEMO, Twicea stock, HGP.00.250.CLAP reference price.LEMO. HGP.00.250.CLAP parameters, HGP.00.250.CLAP Datasheet PDF and pin diagram description download.You can use the HGP.00.250.CLAP Coaxial Connectors (RF), DSP Datesheet PDF, find HGP.00.250.CLAP pin diagram and circuit diagram and usage method of function,HGP.00.250.CLAP electronics tutorials.You can download from the Twicea.