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XP3002000-01R Tech Specifications

Lantronix  XP3002000-01R technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 4 Weeks
Mount Panel
Package / Case Module
Memory Types FLASH, RAM
Operating Temperature -40°C~85°C
Packaging Bulk
Series XPort® AR™
Published 2011
Size / Dimension 0.65 x 1.8 16.5mmx45.7mm
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Connector Type RJ45
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Frequency 120MHz
Operating Supply Voltage 3.3V
Interface Ethernet, RS-232
Speed 120MHz
RAM Size 1.25MB
Core Processor DSTni-EX
Data Rate 300 bps
Module/Board Type MPU Core
Flash Size 4MB
Co-Processor XPort AR
REACH SVHC Unknown
Radiation Hardening No
RoHS Status ROHS3 Compliant
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XP3002000-01R Documents

Download datasheets and manufacturer documentation for   XP3002000-01R

XP3002000-01R brand manufacturers: Lantronix, Inc., Twicea stock, XP3002000-01R reference price.Lantronix, Inc.. XP3002000-01R parameters, XP3002000-01R Datasheet PDF and pin diagram description download.You can use the XP3002000-01R Embedded - Microcontroller, Microprocessor, FPGA Modules, DSP Datesheet PDF, find XP3002000-01R pin diagram and circuit diagram and usage method of function,XP3002000-01R electronics tutorials.You can download from the Twicea.