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KVR32S22D8/16 Tech Specifications

Kingston  KVR32S22D8/16 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

ECCN (US) EAR99
Module DRAM Module
Module Density 16Gbyte
Number of Chip per Module 16Chip per Modules
Chip Density (bit) 8G
Data Bus Width (bit) 64
Maximum Clock Rate (MHz) 3200
Chip Configuration 1Gx8
Chip Package Type FBGA
Typical Operating Supply Voltage (V) 1.2
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Module Sides Double
ECC Support No
Number of Ranks DualRank
CAS Latency 22
PC Type PC4-3200
SPD EEPROM Support Yes
Supplier Package SODIMM
Mounting Socket
Package Height 30
Package Length 69.6
Package Width 3.7(Max)
PCB changed 260
Pins 260
Part Status Obsolete
Pin Count 260
Voltage 1.2V
Speed 3200MHz
Organization 2Gx64
Capacity 16 GB
Self Refresh Yes
Module Type 260SODIMM
RoHS Status RoHS Compliant
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KVR32S22D8/16 Documents

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