KVR16N11K2/16 Tech Specifications

Kingston  KVR16N11K2/16 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

ECCN (US) EAR99
HTS 8473.30.11.40
Module DRAM Module
Module Density 16Gbyte
Number of Chip per Module 32Chip per Modules
Chip Density (bit) 4G
Data Bus Width (bit) 64
Maximum Clock Rate (MHz) 1600
Chip Configuration 512Mx8
Chip Package Type FBGA
Minimum Operating Supply Voltage (V) 1.425
Typical Operating Supply Voltage (V) 1.5
Maximum Operating Supply Voltage (V) 1.575
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Module Sides Double
ECC Support No
Number of Ranks DualRank
Number of Chip Banks 8Chip Banks
CAS Latency 11
PC Type PC3-12800
SPD EEPROM Support No
Standard Package Name DIM
Supplier Package DIMM
Mounting Socket
Package Height 30
Package Length 133.35
PCB changed 240
Lead Shape No Lead
Memory 16GB
Memory capacity 16GB
Model ValueRAM
Part Status Active
Type ValueRAM
Pin Count 240
Configuration 240-pin DIMM
Organization 1Gx64x2
PLL No
Features Unbuffered
Self Refresh No
Module Type 240DIMM
RoHS Status Yes with exemptions
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