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KVR16LS11/8BK Tech Specifications

Kingston  KVR16LS11/8BK technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

ECCN (US) EAR99
HTS 8473.30.11.40
Module DRAM Module
Module Density 8Gbyte
Number of Chip per Module 16Chip per Modules
Chip Density (bit) 4G
Data Bus Width (bit) 64
Maximum Clock Rate (MHz) 1600
Chip Configuration 512Mx8
Chip Package Type FBGA
Minimum Operating Supply Voltage (V) 1.28/1.425
Typical Operating Supply Voltage (V) 1.35/1.5
Maximum Operating Supply Voltage (V) 1.45/1.575
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Module Sides Double
ECC Support No
Number of Ranks DualRank
CAS Latency 11
PC Type PC3L-12800
SPD EEPROM Support No
Part Status Active
Organization 1Gx64
PLL No
Self Refresh Yes
Module Type 204SODIMM
RoHS Status Yes with exemptions
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KVR16LS11/8BK Documents

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