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KVR13LR9D8/4HC Tech Specifications

Kingston  KVR13LR9D8/4HC technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Package Height 30
Package Length 133.35
PCB changed 240
Lead Shape No Lead
ECCN (US) EAR99
Module DRAM Module
Module Density 4Gbyte
Number of Chip per Module 18Chip per Modules
Chip Density (bit) 2G
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 1333
Chip Configuration 256Mx8
Chip Package Type FBGA
Minimum Operating Supply Voltage (V) 1.28/1.425
Typical Operating Supply Voltage (V) 1.35/1.5
Maximum Operating Supply Voltage (V) 1.45/1.575
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Module Sides Double
ECC Support Yes
Number of Ranks DualRank
Number of Chip Banks 8Chip Banks
CAS Latency 9
PC Type PC3-10600
SPD EEPROM Support No
Standard Package Name DIM
Supplier Package RDIMM
Mounting Socket
Part Status Obsolete
Pin Count 240
Organization 512Mx72
PLL Yes
Self Refresh No
Module Type 240RDIMM
RoHS Status Supplier Unconfirmed
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KVR13LR9D8/4HC Documents

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