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KVR1333D3E9S/8G Tech Specifications

Kingston  KVR1333D3E9S/8G technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mount Socket
Number of Pins 240Pins
Lead Shape No Lead
PCB changed 240
Package Length 133.35
Package Height 30
Mounting Socket
Supplier Package DIMM
Standard Package Name DIM
SPD EEPROM Support No
PC Type PC3-10600
CAS Latency 9
Number of Chip Banks 8Chip Banks
Number of Ranks DualRank
ECC Support Yes
Module Sides Double
Maximum Operating Temperature (°C) 85
Minimum Operating Temperature (°C) 0
Maximum Operating Supply Voltage (V) 1.575
Typical Operating Supply Voltage (V) 1.5
Minimum Operating Supply Voltage (V) 1.425
Chip Package Type FBGA
Chip Configuration 512Mx8
Maximum Clock Rate (MHz) 1333
Data Bus Width (bit) 72
Chip Density (bit) 4G
Number of Chip per Module 18Chip per Modules
Module Density 8Gbyte
Module DRAM Module
ECCN (US) EAR99
Number of Elements 18 Elements
RoHS Compliant
Part Status Obsolete
Max Operating Temperature 85 °C
Min Operating Temperature 0 °C
Pin Count 240
Operating Supply Voltage 1.5 V
Max Supply Voltage 1.575 V
Min Supply Voltage 1.425 V
Organization 1Gx72
Max Frequency 1.333 GHz
PLL No
Self Refresh No
Module Type 240DIMM
RoHS Status Yes with exemptions
Radiation Hardening No
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KVR1333D3E9S/8G Documents

Download datasheets and manufacturer documentation for   KVR1333D3E9S/8G

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