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KVR1066D3S8N7/2G Tech Specifications

Kingston  KVR1066D3S8N7/2G technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

ECCN (US) EAR99
Module DRAM Module
Module Density 2Gbyte
Number of Chip per Module 8Chip per Modules
Chip Density (bit) 2G
Data Bus Width (bit) 64
Maximum Clock Rate (MHz) 1066
Chip Configuration 256Mx8
Chip Package Type FBGA
Minimum Operating Supply Voltage (V) 1.425
Typical Operating Supply Voltage (V) 1.5
Maximum Operating Supply Voltage (V) 1.575
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Module Sides Single
ECC Support No
Number of Ranks SingleRank
Number of Chip Banks 8Chip Banks
CAS Latency 7
PC Type PC3-8500
SPD EEPROM Support No
Standard Package Name DIM
Supplier Package DIMM
Mounting Socket
Package Height 30
Package Length 133.35
PCB changed 240
Lead Shape No Lead
Part Status Obsolete
Pin Count 240
Organization 256Mx64
PLL No
Self Refresh No
Module Type 240DIMM
RoHS Status Supplier Unconfirmed
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KVR1066D3S8N7/2G Documents

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