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KSM32RD8/16HDR Tech Specifications

Kingston  KSM32RD8/16HDR technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

ECCN (US) 4A994.a
HTS 8473.30.11.40
Module DRAM Module
Module Density 16Gbyte
Number of Chip per Module 18Chip per Modules
Chip Density (bit) 8G
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 3200
Chip Configuration 1Gx8
Chip Package Type FBGA
Typical Operating Supply Voltage (V) 1.2
Operating Current (mA) 1787
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Module Sides Double
ECC Support Yes
Number of Ranks DualRank
CAS Latency 22
SPD EEPROM Support No
Part Status Active
Organization 2Gx72
PLL No
Self Refresh Yes
Module Type 288RDIMM
RoHS Status RoHS Compliant
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KSM32RD8/16HDR Documents

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