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KSM26SED8/16ME Tech Specifications

Kingston  KSM26SED8/16ME technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

ECCN (US) EAR99
HTS 8473.30.11.40
Module DRAM Module
Module Density 16Gbyte
Number of Chip per Module 18Chip per Modules
Chip Density (bit) 8G
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 2666
Chip Configuration 1Gx8
Chip Package Type FBGA
Typical Operating Supply Voltage (V) 1.2
Operating Current (mA) 1629
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
ECC Support Yes
Number of Ranks DualRank
CAS Latency 17
Supplier Package SODIMM
Mounting Socket
Package Height 30
Package Length 69.6
Package Width 3.7(Max)
PCB changed 260
Part Status Obsolete
Pin Count 260
Organization 2Gx72
Module Type 260SODIMM
RoHS Status RoHS Compliant
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KSM26SED8/16ME Documents

Download datasheets and manufacturer documentation for   KSM26SED8/16ME

KSM26SED8/16ME brand manufacturers: Kingston Technology, Twicea stock, KSM26SED8/16ME reference price.Kingston Technology. KSM26SED8/16ME parameters, KSM26SED8/16ME Datasheet PDF and pin diagram description download.You can use the KSM26SED8/16ME Memory Cards, DSP Datesheet PDF, find KSM26SED8/16ME pin diagram and circuit diagram and usage method of function,KSM26SED8/16ME electronics tutorials.You can download from the Twicea.