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KSM24SED8/16ME Tech Specifications

Kingston  KSM24SED8/16ME technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 4 Weeks, 2 Days
Surface Mount NO
Number of Terminals 260Terminals
ECCN (US) EAR99
Module DRAM Module
Module Density 16Gbyte
Number of Chip per Module 18Chip per Modules
Chip Density (bit) 8G
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 2400
Chip Configuration 1Gx8
Chip Package Type FBGA
Typical Operating Supply Voltage (V) 1.2
Operating Current (mA) 1530
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
ECC Support Yes
Number of Ranks DualRank
CAS Latency 17
Supplier Package SODIMM
Mounting Socket
Package Height 30
Package Length 69.6
Package Width 3.7(Max)
PCB changed 260
Package Description SODIMM-260
Package Style MICROELECTRONIC ASSEMBLY
Number of Words Code 2000000000Words Codes
Package Body Material UNSPECIFIED
Operating Temperature-Max 85 °C
Manufacturer Part Number KSM24SED8/16ME
Number of Words 2147483648 wordsWord
Supply Voltage-Nom (Vsup) 1.2 V
Package Code DIMM
Package Shape RECTANGULAR
Manufacturer Kingston Technology Company
Part Life Cycle Code Contact Manufacturer
Ihs Manufacturer KINGSTON TECHNOLOGY COMPANY INC
Risk Rank 5.59
Part Status Obsolete
Additional Feature WD-MAX
Technology CMOS
Terminal Position DUAL
Terminal Form NO LEAD
Number of Functions 1Function
Reach Compliance Code unknown
Pin Count 260
JESD-30 Code R-XDMA-N260
Temperature Grade OTHER
Number of Ports 1Port
Operating Mode SYNCHRONOUS
Organization 2Gx72
Seated Height-Max 30.12 mm
Memory Width 72
Memory Density 154618822656 bit
Memory IC Type DDR DRAM MODULE
Access Mode MULTI BANK PAGE BURST
Module Type 260SODIMM
Width 3.7 mm
Length 69.6 mm
RoHS Status Yes with exemptions
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KSM24SED8/16ME Documents

Download datasheets and manufacturer documentation for   KSM24SED8/16ME

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