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KSM24RS4/16MEI Tech Specifications

Kingston  KSM24RS4/16MEI technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 4 Weeks, 2 Days
Surface Mount NO
Number of Terminals 288Terminals
ECCN (US) EAR99
HTS 8473.30.11.40
Module DRAM Module
Module Density 16Gbyte
Number of Chip per Module 18Chip per Modules
Chip Density (bit) 8G
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 2400
Chip Configuration 2Gx4
Chip Package Type FBGA
Typical Operating Supply Voltage (V) 1.2
Operating Current (mA) 2160
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
ECC Support Yes
Number of Ranks SingleRank
CAS Latency 17
Supplier Package RDIMM
Mounting Socket
Package Height 31.25
Package Length 133.35
PCB changed 288
Package Description DIMM,
Package Style MICROELECTRONIC ASSEMBLY
Number of Words Code 2000000000Words Codes
Package Body Material UNSPECIFIED
Operating Temperature-Max 85 °C
Manufacturer Part Number KSM24RS4/16MEI
Number of Words 2147483648 wordsWord
Supply Voltage-Nom (Vsup) 1.2 V
Package Code DIMM
Package Shape RECTANGULAR
Manufacturer Kingston Technology Company
Part Life Cycle Code End Of Life
Ihs Manufacturer KINGSTON TECHNOLOGY COMPANY INC
Risk Rank 5.59
Part Status Obsolete
Technology CMOS
Terminal Position DUAL
Terminal Form NO LEAD
Number of Functions 1Function
Reach Compliance Code unknown
Pin Count 288
JESD-30 Code R-XDMA-N288
Temperature Grade OTHER
Number of Ports 1Port
Operating Mode SYNCHRONOUS
Organization 2Gx72
Seated Height-Max 31.37 mm
Memory Width 72
Memory Density 154618822656 bit
Memory IC Type DDR DRAM MODULE
Access Mode MULTI BANK PAGE BURST
Module Type 288DIMM
Length 133.35 mm
RoHS Status RoHS Compliant
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KSM24RS4/16MEI Documents

Download datasheets and manufacturer documentation for   KSM24RS4/16MEI

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