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- T356J685K050AS
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T356J685K050AS Tech Specifications
KEMET T356J685K050AS technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 21 Weeks | |
| Mount | Through Hole | |
| Mounting Type | Through Hole | |
| Package / Case | Radial, Disc | |
| Terminal Shape | WIRE | |
| Dielectric Material | TANTALUM (DRY/SOLID) | |
| Operating Temperature | -55°C~125°C | |
| Packaging | Bulk | |
| Series | T356, UltraDip II | |
| Published | 2004 | |
| Size / Dimension | 0.331Dia 8.40mm | |
| Tolerance | ±10% | |
| JESD-609 Code | e0 | |
| Pbfree Code | no | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 2Terminations | |
| Termination | Radial | |
| ECCN Code | EAR99 | |
| Type | Conformal Coated | |
| Terminal Finish | Tin/Lead (Sn60Pb40) | |
| HTS Code | 8532.21.00.40 | |
| Capacitance | 6.8μF | |
| Voltage - Rated DC | 50V | |
| Packing Method | TR | |
| Reach Compliance Code | not_compliant | |
| Lead Pitch | 5.08mm | |
| ESR (Equivalent Series Resistance) | 2Ohm | |
| Polarity | POLARIZED | |
| Lead Spacing | 0.200 5.08mm | |
| Lead Diameter | 500 μm | |
| Leakage Current | 2.7μA | |
| Tan Delta | 0.05 | |
| Dissipation Factor | 5 % | |
| Manufacturer Size Code | J | |
| Features | General Purpose | |
| Diameter | 8.4mm | |
| Height | 14mm | |
| Height Seated (Max) | 0.551 14.00mm | |
| RoHS Status | Non-RoHS Compliant | |
| Lead Free | Contains Lead |
T356J685K050AS Documents
Download datasheets and manufacturer documentation for T356J685K050AS
- DatasheetsT35x Series Datasheet
- Mfg CAD ModelsT356J685K050AS.stp
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