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- T350G475K050AT
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T350G475K050AT Tech Specifications
KEMET T350G475K050AT technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 10 Weeks | |
| Mount | PCB, Through Hole | |
| Mounting Type | Through Hole | |
| Package / Case | Radial, Disc | |
| Terminal Shape | WIRE | |
| Dielectric Material | Tantalum | |
| Operating Temperature | -55°C~125°C | |
| Packaging | Bulk | |
| Series | T350, UltraDip II | |
| Published | 2004 | |
| Size / Dimension | 0.248Dia 6.30mm | |
| Tolerance | ±10% | |
| JESD-609 Code | e3 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 2Terminations | |
| Termination | Radial | |
| ECCN Code | EAR99 | |
| Type | Conformal Coated | |
| Terminal Finish | Matte Tin (Sn) | |
| HTS Code | 8532.21.00.40 | |
| Capacitance | 4.7μF | |
| Voltage - Rated DC | 50V | |
| Packing Method | TR | |
| Lead Pitch | 2.54mm | |
| ESR (Equivalent Series Resistance) | 2.5Ohm | |
| Polarity | Polar | |
| Lead Spacing | 0.100 2.54mm | |
| Lead Diameter | 500 μm | |
| Voltage | 50V | |
| Leakage Current | 1.9μA | |
| Tan Delta | 0.05 | |
| Dissipation Factor | 5 % | |
| Manufacturer Size Code | G | |
| Features | General Purpose | |
| Diameter | 6.3mm | |
| Height | 10.2mm | |
| Height Seated (Max) | 0.402 10.20mm | |
| REACH SVHC | No SVHC | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free | 
T350G475K050AT Documents
Download datasheets and manufacturer documentation for T350G475K050AT
- DatasheetsT35x Series Datasheet
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