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MM70-314B1-2-R300 Tech Specifications

JAE  MM70-314B1-2-R300 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Contact Plating Gold
Mounting Type Surface Mount, Right Angle
Housing Material Plastic
Material - Insulation Thermoplastic
RoHS Details
Mounting Styles SMD/SMT
Contact Materials Copper Alloy
Maximum Operating Temperature + 85 C
Minimum Operating Temperature - 40 C
Factory Pack QuantityFactory Pack Quantity 300
Package Tape & Reel (TR);Cut Tape (CT);
Base Product Number MM70-314
Mfr JAE Electronics
Product Status Active
Series MM70
Packaging Cut Tape
Operating Temperature -40°C ~ 85°C
Termination Solder
Number of Positions 314 PositionPosition
Color Black
Number of Rows 2 RowRow
Gender Female
Contact Type -
Pitch 0.020 (0.50mm)
Current Rating 500 mA
Contact Finish Gold
Termination Style Solder
Card Type MXM 3.0
Read Out Dual
Insulation Resistance 50 MOhms
Number of Positions/Bay/Row -
Flange Feature -
Product Connectors
Mounting Angle Right Angle
Features Board Guide, Latches
Contact Finish Thickness 11.8µin (0.30µm)
Card Thickness 0.047 (1.20mm)
Board Thickness 3 mm
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