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- MM60-EZH039-B5-R850
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MM60-EZH039-B5-R850 Tech Specifications
JAE MM60-EZH039-B5-R850 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 14 Weeks | |
| Contact Plating | Tin | |
| Mount | Socket | |
| Package / Case | SMD/SMT | |
| Contact Materials | Stainless Steel, Steel | |
| Packaging | Cut Tape (CT) | |
| Series | MM60 | |
| Published | 2006 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Termination | Solder | |
| Current Rating | 500mA | |
| Contact Resistance | 55mOhm | |
| Accessory Type | Latch | |
| Height | 3.9mm | |
| REACH SVHC | Unknown | |
| RoHS Status | RoHS Compliant | |
| Flammability Rating | UL94 V-0 |
MM60-EZH039-B5-R850 Documents
Download datasheets and manufacturer documentation for MM60-EZH039-B5-R850
- DatasheetsMM60-EZH039-B5-R850-JAE-Electronics-datasheet-5345663.pdf MM60-B Series Spec Sheet Card Conn, SIM, CF, DIMM, PCIe MM60-EZH039-B5-R850-JAE-Electronics-datasheet-5401066.pdf MM60-EZH039-B5-R850-JAE-Electronics-datasheet-13225783.pdf MM60-EZH039-B5 Drawing
- Other Related DocumentsCard Selection Guide
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