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FI-XB30SRL-HF11 Tech Specifications

JAE  FI-XB30SRL-HF11 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Contact Plating Gold
Mount Edge
Mounting Type Board Cutout, Bottom Mount, Surface Mount, Right Angle, Reverse Mount
Housing Material Nylon
Contact Finish Mating Gold
Contact Materials Copper Alloy
Insulation Materials Plastic
Voltage Rated 200V
Operating Temperature -40°C~80°C
Packaging Bulk
Series FI-X
Published 2003
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Receptacle
Number of Positions 30Positions
Max Operating Temperature 80°C
Min Operating Temperature -40°C
Color Black
Applications General Purpose
Number of Rows 1Row
Gender Receptacle
Fastening Type Friction Lock
Contact Type Non-Gendered
Current Rating (Amps) 1A per Contact
Pitch 1mm
Orientation Right Angle
Style Board to Cable/Wire
Number of Positions Loaded All
Current Rating 1A
Pitch - Mating 0.039 1.00mm
Insulation Color Black
Number of Contacts 30Contacts
Contact Finish - Post Tin
Insulation Resistance 100MOhm
Contact Location Bottom
Features Grounding Pins, Shielded, Solder Retention
Contact Finish Thickness - Mating 12.0μin 0.30μm
Material Flammability Rating UL94 V-0
REACH SVHC Unknown
RoHS Status RoHS Compliant
Flammability Rating UL94 V-0
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FI-XB30SRL-HF11 Documents

Download datasheets and manufacturer documentation for   FI-XB30SRL-HF11

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