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FI-SE30P-HFE-E3000 Tech Specifications
JAE FI-SE30P-HFE-E3000 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Contact Plating | Gold | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount, Right Angle | |
| Number of Pins | 30Pins | |
| Contact Shape | Square | |
| Contact Finish Mating | Gold | |
| Contact Materials | Copper Alloy | |
| Insulation Materials | Liquid Crystal Polymer (LCP), Glass Filled | |
| Voltage Rated | 200V | |
| Operating Temperature | -40°C~80°C | |
| Packaging | Tape & Reel (TR) | |
| Series | FI | |
| Part Status | Obsolete | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Termination | Solder | |
| Connector Type | Receptacle | |
| Number of Positions | 30Positions | |
| Color | Beige | |
| Number of Rows | 1Row | |
| Fastening Type | Friction Lock | |
| Contact Type | Male Pin | |
| Current Rating (Amps) | 1A per Contact | |
| Pitch | 1.2446mm | |
| Insulation Height | 0.083 2.10mm | |
| Style | Board to Cable/Wire | |
| Number of Positions Loaded | All | |
| Pitch - Mating | 0.049 1.25mm | |
| Insulation Color | Beige | |
| Shrouding | Shrouded - 4 Wall | |
| Contact Finish - Post | Tin or Tin-Alloy | |
| Features | Shielded, Solder Retention | |
| Material Flammability Rating | UL94 V-0 | |
| RoHS Status | RoHS Compliant |
FI-SE30P-HFE-E3000 Documents
Download datasheets and manufacturer documentation for FI-SE30P-HFE-E3000
- PCN Obsolescence/ EOLMultiple Devices 28/Feb/2017
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