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HC5513BIM Tech Specifications

Intersil  HC5513BIM technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mount Through Hole
Package / Case DIP
Power Dissipation (Max) 1.5W
Published 2000
JESD-609 Code e0
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 28Terminations
Terminal Finish Tin/Lead (Sn/Pb)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Terminal Position QUAD
Terminal Form J BEND
Peak Reflow Temperature (Cel) 225
Number of Functions 1Function
Supply Voltage 5V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PQCC-J28
Qualification Status Not Qualified
Power Supplies +-5V
Temperature Grade INDUSTRIAL
Number of Circuits 1Circuit
Operating Supply Current 2.25mA
Telecom IC Type SLIC
Neg Supply Voltage-Nom -5V
Battery Feed CONSTANT CURRENT
Hybrid 2-4 CONVERSION
Battery Supply -28 V
Height Seated (Max) 4.57mm
RoHS Status RoHS Compliant
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HC5513BIM Documents

Download datasheets and manufacturer documentation for   HC5513BIM

HC5513BIM brand manufacturers: Intersil (Renesas Electronics America), Twicea stock, HC5513BIM reference price.Intersil (Renesas Electronics America). HC5513BIM parameters, HC5513BIM Datasheet PDF and pin diagram description download.You can use the HC5513BIM Interface - Telecom, DSP Datesheet PDF, find HC5513BIM pin diagram and circuit diagram and usage method of function,HC5513BIM electronics tutorials.You can download from the Twicea.