Intersil Corporation HM1-6641-9 Memory Modules
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HM1-6641-9 Tech Specifications
Intersil HM1-6641-9 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Surface Mount | NO | |
| Number of Terminals | 24Terminals | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTERSIL CORP | |
| Package Description | DIP, DIP24,.6 | |
| Number of Words | 512 wordsWord | |
| Number of Words Code | 512Words Codes | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | CERAMIC | |
| Package Code | DIP | |
| Package Equivalence Code | DIP24,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| JESD-609 Code | e0 | |
| ECCN Code | EAR99 | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| HTS Code | 8542.32.00.71 | |
| Terminal Position | DUAL | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Reach Compliance Code | not_compliant | |
| JESD-30 Code | R-XDIP-T24 | |
| Qualification Status | Not Qualified | |
| Temperature Grade | INDUSTRIAL | |
| Organization | 512X8 | |
| Memory Width | 8 | |
| Memory Density | 4096 bit | |
| Memory IC Type | OTP ROM |
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