CD54HCT259F3A Tech Specifications

Intersil  CD54HCT259F3A technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 6 Weeks
Surface Mount NO
Number of Terminals 16Terminals
RoHS Yes
Package Description DIP-16
Package Style IN-LINE
Load Capacitance (CL) 50 pF
Package Body Material CERAMIC, GLASS-SEALED
Package Equivalence Code DIP16,.3
Operating Temperature-Min -55 °C
Reflow Temperature-Max (s) NOT SPECIFIED
Operating Temperature-Max 125 °C
Manufacturer Part Number CD54HCT259F3A
Supply Voltage-Nom (Vsup) 5 V
Package Code DIP
Package Shape RECTANGULAR
Manufacturer Texas
Part Life Cycle Code Active
Ihs Manufacturer Texas INC
Risk Rank 1.66
Part Package Code DIP
Prop. 49 ns
Usage Level Military grade
ECCN Code EAR99
Additional Feature 1:8 DMUX FOLLOWED BY LATCH
HTS Code 8542.39.00.01
Subcategory FF/Latch
Packing Method TUBE
Technology CMOS
Terminal Position DUAL
Terminal Form THROUGH-HOLE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Terminal Pitch 2.54 mm
Reach Compliance Code not_compliant
Pin Count 16
JESD-30 Code R-GDIP-T16
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.5 V
Power Supplies 5 V
Temperature Grade MILITARY
Supply Voltage-Min (Vsup) 4.5 V
Number of Bits 8Bits
Family HCT
Seated Height-Max 5.08 mm
Output Polarity TRUE
Logic IC Type D LATCH
Max I(ol) 0.004 A
Screening Level 38535Q/M;38534H;883B
Trigger Type LOW LEVEL
Propagation Delay (tpd) 57 ns
Schmitt Trigger No
Power Supply Current-Max (ICC) 0.08 mA
Width 7.62 mm
Length 19.56 mm
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