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PF28F1602C3TD70 Tech Specifications

Intel  PF28F1602C3TD70 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 66Terminals
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer INTEL CORP
Part Package Code BGA
Package Description LFBGA, BGA66,8X12,32
Access Time-Max 70 ns
Number of Words 1048576 wordsWord
Number of Words Code 1000000Words Codes
Operating Temperature-Max 85 °C
Operating Temperature-Min -25 °C
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA66,8X12,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Supply Voltage-Nom (Vsup) 3 V
ECCN Code EAR99
Additional Feature SRAM IS ORGANIZED AS 256K X 16
HTS Code 8542.32.00.71
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Terminal Pitch 0.8 mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 66
JESD-30 Code R-PBGA-B66
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.3 V
Temperature Grade COMMERCIAL EXTENDED
Supply Voltage-Min (Vsup) 2.7 V
Operating Mode ASYNCHRONOUS
Supply Current-Max 0.05 mA
Organization 1MX16
Seated Height-Max 1.4 mm
Memory Width 16
Standby Current-Max 0.000005 A
Memory Density 16777216 bit
Memory IC Type MEMORY CIRCUIT
Mixed Memory Type FLASH+SRAM
Length 10 mm
Width 8 mm
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PF28F1602C3TD70 Documents

Download datasheets and manufacturer documentation for   PF28F1602C3TD70

  • Datasheets
PF28F1602C3TD70 brand manufacturers: Intel Corporation, Twicea stock, PF28F1602C3TD70 reference price.Intel Corporation. PF28F1602C3TD70 parameters, PF28F1602C3TD70 Datasheet PDF and pin diagram description download.You can use the PF28F1602C3TD70 Specialized, DSP Datesheet PDF, find PF28F1602C3TD70 pin diagram and circuit diagram and usage method of function,PF28F1602C3TD70 electronics tutorials.You can download from the Twicea.