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GT28F160B3B90 Tech Specifications

Intel  GT28F160B3B90 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 48Terminals
Package Description CSP, MICRO, BGA-48
Package Style GRID ARRAY, THIN PROFILE
Number of Words Code 1000000Words Codes
Package Body Material PLASTIC/EPOXY
Package Equivalence Code BGA46,6X8,30
Operating Temperature-Min -40 °C
Reflow Temperature-Max (s) 30
Access Time-Max 90 ns
Operating Temperature-Max 85 °C
Rohs Code No
Manufacturer Part Number GT28F160B3B90
Number of Words 1048576 wordsWord
Supply Voltage-Nom (Vsup) 3 V
Package Code TBGA
Package Shape RECTANGULAR
Manufacturer Intel Corporation
Part Life Cycle Code Transferred
Ihs Manufacturer INTEL CORP
Risk Rank 8.5
Part Package Code BGA
ECCN Code EAR99
Type NOR TYPE
Additional Feature USER-SELECTABLE 12V VPP; BOTTOM BOOT BLOCK
HTS Code 8542.32.00.51
Subcategory Flash Memories
Technology MOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 240
Number of Functions 1Function
Terminal Pitch 1 mm
Reach Compliance Code compliant
Pin Count 48
JESD-30 Code R-PBGA-B48
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6 V
Power Supplies 1.8/3.6,3/3.3 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 2.7 V
Operating Mode ASYNCHRONOUS
Supply Current-Max 0.035 mA
Organization 1MX16
Seated Height-Max 1.2 mm
Memory Width 16
Standby Current-Max 0.000005 A
Memory Density 16777216 bit
Parallel/Serial PARALLEL
Memory IC Type FLASH
Programming Voltage 2.7 V
Data Polling NO
Toggle Bit NO
Command User Interface YES
Number of Sectors/Size 8,31
Sector Size 4K,32K
Boot Block BOTTOM
Width 10 mm
Length 13 mm
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