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GT28F008B3T110 Tech Specifications

Intel  GT28F008B3T110 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 48-VFBGA
Surface Mount YES
Supplier Device Package 48-uBGA (7.7x9)
Number of Terminals 48Terminals
Package Bulk
Mfr Intel
Product Status Active
Memory Types Non-Volatile
Package Description CSP, MICRO, BGA-48
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Number of Words Code 1000000Words Codes
Package Body Material PLASTIC/EPOXY
Operating Temperature-Min -40 °C
Reflow Temperature-Max (s) NOT SPECIFIED
Access Time-Max 110 ns
Operating Temperature-Max 85 °C
Rohs Code No
Manufacturer Part Number GT28F008B3T110
Number of Words 1048576 wordsWord
Supply Voltage-Nom (Vsup) 3 V
Package Code VFBGA
Package Shape RECTANGULAR
Manufacturer Rochester Electronics LLC
Part Life Cycle Code Contact Manufacturer
Ihs Manufacturer ROCHESTER ELECTRONICS LLC
Risk Rank 5.74
Part Package Code BGA
Operating Temperature -40°C ~ 85°C (TA)
Series -
JESD-609 Code e0
Pbfree Code No
ECCN Code EAR99
Type NOR TYPE
Terminal Finish TIN LEAD
Additional Feature TOP BOOT BLOCK
HTS Code 8542.32.00.51
Technology FLASH - Boot Block
Voltage - Supply 2.7V ~ 3.6V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Terminal Pitch 0.75 mm
Reach Compliance Code unknown
Pin Count 48
JESD-30 Code R-PBGA-B48
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 2.7 V
Memory Size 8Mbit
Operating Mode ASYNCHRONOUS
Access Time 110 ns
Memory Format FLASH
Memory Interface CUI
Organization 1MX8
Seated Height-Max 1 mm
Memory Width 8
Write Cycle Time - Word, Page -
Memory Density 8388608 bit
Parallel/Serial PARALLEL
Memory IC Type FLASH
Programming Voltage 3 V
Boot Block TOP
Memory Organization 1M x 8
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