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GE28F640W18BD60 Tech Specifications

Intel  GE28F640W18BD60 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 56Terminals
Package Description VFBGA, BGA56,7X8,30
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Number of Words Code 4000000Words Codes
Package Body Material PLASTIC/EPOXY
Package Equivalence Code BGA56,7X8,30
Operating Temperature-Min -40 °C
Reflow Temperature-Max (s) 30
Access Time-Max 60 ns
Operating Temperature-Max 85 °C
Rohs Code No
Manufacturer Part Number GE28F640W18BD60
Number of Words 4194304 wordsWord
Supply Voltage-Nom (Vsup) 1.8 V
Package Code VFBGA
Package Shape RECTANGULAR
Manufacturer Intel Corporation
Part Life Cycle Code Transferred
Ihs Manufacturer INTEL CORP
Risk Rank 7.51
Part Package Code BGA
JESD-609 Code e0
ECCN Code 3A991.B.1.A
Type NOR TYPE
Terminal Finish TIN LEAD
Additional Feature SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
HTS Code 8542.32.00.51
Subcategory Flash Memories
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 240
Number of Functions 1Function
Terminal Pitch 0.75 mm
Reach Compliance Code compliant
Pin Count 56
JESD-30 Code R-PBGA-B56
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.95 V
Power Supplies 1.5/1.8,1.8 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 1.7 V
Operating Mode ASYNCHRONOUS
Supply Current-Max 0.04 mA
Organization 4MX16
Seated Height-Max 1 mm
Memory Width 16
Standby Current-Max 0.000005 A
Memory Density 67108864 bit
Parallel/Serial PARALLEL
Memory IC Type FLASH
Programming Voltage 1.8 V
Data Polling NO
Toggle Bit NO
Command User Interface YES
Number of Sectors/Size 8,127
Sector Size 4K,32K
Page Size 4 words
Boot Block BOTTOM
Common Flash Interface YES
Width 7.7 mm
Length 9 mm
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