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EP2AGX45DF29I3N Tech Specifications

Intel  EP2AGX45DF29I3N technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 780-BBGA, FCBGA
Surface Mount YES
Number of I/Os 364I/Os
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Arria II GX
JESD-609 Code e1
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 780Terminations
ECCN Code 3A991
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.39.00.01
Voltage - Supply 0.87V~0.93V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.9V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number EP2AGX45
JESD-30 Code S-PBGA-B780
Number of Outputs 364Outputs
Qualification Status Not Qualified
Power Supplies 0.91.2/3.31.52.5V
Clock Frequency 500MHz
Number of Inputs 364Inputs
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 42959Logic Elements/Cells
Total RAM Bits 3517440
Number of LABs/CLBs 1805LABs/CLBs
Length 29mm
Height Seated (Max) 2.7mm
Width 29mm
RoHS Status RoHS Compliant
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