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EP2A25F672C9 Tech Specifications

Intel  EP2A25F672C9 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 672-BBGA, FCBGA
Surface Mount YES
Number of I/Os 492I/Os
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series APEX II
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 672Terminations
ECCN Code 3A001.A.7.A
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Voltage - Supply 1.425V~1.575V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 220
Supply Voltage 1.5V
Terminal Pitch 1mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number EP2A25
JESD-30 Code S-PBGA-B672
Number of Outputs 480Outputs
Qualification Status Not Qualified
Power Supplies 1.51.5/3.3V
Propagation Delay 2.23 ns
Number of Inputs 480Inputs
Programmable Logic Type LOADABLE PLD
Number of Logic Elements/Cells 24320Logic Elements/Cells
Total RAM Bits 622592
Number of Gates 2750000Gates
Number of LABs/CLBs 2430LABs/CLBs
Output Function MACROCELL
Length 27mm
Height Seated (Max) 2.1mm
Width 27mm
RoHS Status Non-RoHS Compliant
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