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EP1K100FI256-2 Tech Specifications

Intel  EP1K100FI256-2 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 256-BBGA
Surface Mount YES
Number of I/Os 186I/Os
Operating Temperature -40°C~85°C TA
Packaging Tray
Series ACEX-1K®
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256Terminations
ECCN Code 3A991
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Voltage - Supply 2.375V~2.625V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 220
Supply Voltage 2.5V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number EP1K100
JESD-30 Code S-PBGA-B256
Number of Outputs 186Outputs
Qualification Status Not Qualified
Power Supplies 2.52.5/3.3V
Clock Frequency 37.5MHz
Propagation Delay 0.5 ns
Number of Inputs 186Inputs
Programmable Logic Type LOADABLE PLD
Number of Logic Elements/Cells 4992Logic Elements/Cells
Total RAM Bits 49152
Number of Gates 257000Gates
Number of LABs/CLBs 624LABs/CLBs
Output Function MIXED
Length 17mm
Height Seated (Max) 2.1mm
Width 17mm
RoHS Status Non-RoHS Compliant
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EP1K100FI256-2 Documents

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