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EP1AGX50DF780C6N Tech Specifications

Intel  EP1AGX50DF780C6N technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 780-BBGA
Surface Mount YES
Number of I/Os 350I/Os
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series Arria GX
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 780Terminations
ECCN Code 3A001.A.7.A
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.39.00.01
Voltage - Supply 1.15V~1.25V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number EP1AGX50
JESD-30 Code S-PBGA-B780
Number of Outputs 350Outputs
Qualification Status Not Qualified
Power Supplies 1.22.5/3.3V
Clock Frequency 640MHz
Number of Inputs 350Inputs
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 50160Logic Elements/Cells
Total RAM Bits 2475072
Number of LABs/CLBs 2508LABs/CLBs
Length 29mm
Height Seated (Max) 3.5mm
Width 29mm
RoHS Status RoHS Compliant
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EP1AGX50DF780C6N Documents

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