BD82QM57SLGZQ Tech Specifications

Intel  BD82QM57SLGZQ technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Pins 1071Pins
Number of Terminals 1071Terminals
RoHS Compliant
Package Description 27 X 25 MM, 0.60 MM PITCH, FCBGA-1071
Package Style GRID ARRAY, HEAT SINK/SLUG
Package Body Material PLASTIC/EPOXY
Supply Voltage-Nom 1.05 V
Reflow Temperature-Max (s) NOT SPECIFIED
Supply Voltage-Min 0.998 V
Rohs Code Yes
Manufacturer Part Number BD82QM57SLGZQ
Clock Frequency-Max 14.318 MHz
Package Code HBGA
Part Package Code BGA
Risk Rank 5.81
Supply Voltage-Max 1.1 V
Ihs Manufacturer INTEL CORP
Part Life Cycle Code Obsolete
Manufacturer Intel Corporation
Package Shape RECTANGULAR
Max Operating Temperature 108 °C
HTS Code 8542.39.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Pitch 0.6 mm
Reach Compliance Code compliant
Pin Count 1071
JESD-30 Code R-PBGA-B1071
Seated Height-Max 2.358 mm
Address Bus Width 32
Boundary Scan YES
External Data Bus Width 32
Bus Compatibility USB; PCI; I2C; LPC; PS/2
Width 25 mm
Length 27 mm
Radiation Hardening No
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