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AGFC019R25A2I3E Tech Specifications

Intel  AGFC019R25A2I3E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Package / Case 0402 (1005 Metric)
Supplier Device Package 0402
Package Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;
Base Product Number RN73H1E
Mfr KOA Speer Electronics, Inc.
Product Status Active
Number of I/Os 480I/Os
Operating Temperature -55°C ~ 155°C
Series RN73H
Size / Dimension 0.039 L x 0.020 W (1.00mm x 0.50mm)
Tolerance ±0.5%
Number of Terminations 2Terminations
Temperature Coefficient ±50ppm/°C
Resistance 10.1 Ohms
Composition Metal Film
Power (Watts) 0.063W, 1/16W
Failure Rate -
Speed 1.4GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MPU, FPGA
Primary Attributes FPGA - 1.9M Logic Elements
Flash Size -
Features Automotive AEC-Q200, Moisture Resistant
Height Seated (Max) 0.016 (0.40mm)
Ratings AEC-Q200
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