In Stock Min. : 1
Mult. : 1
Not available to buy on line? Want the lower wholesale price? Please
sendRFQ, we will
respond immediately
AGFB012R24B2E3V Tech Specifications
Intel AGFB012R24B2E3V technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Mounting Type | Panel Mount, Through Hole | |
| Package / Case | - | |
| Mounting Feature | - | |
| Shell Material | Stainless Steel | |
| Supplier Device Package | - | |
| Insert Material | Fluorosilicone Elastomer | |
| Backshell Material, Plating | - | |
| Voltage, Rating | 600VAC, 850VDC | |
| Package | Bulk | |
| Primary Material | Metal | |
| Base Product Number | D38999/25HE | |
| Mfr | TE Connectivity Deutsch Connectors | |
| Product Status | Active | |
| Contact Materials | Nickel Iron Alloy | |
| Contact Finish Mating | Gold | |
| Number of I/Os | 768I/Os | |
| Operating Temperature | -65°C ~ 200°C | |
| Series | MIL-DTL-38999 Series III, DTS | |
| Termination | Solder | |
| Connector Type | Receptacle, Female Sockets | |
| Number of Positions | 23Positions | |
| Color | Silver | |
| Applications | Aviation, Communication Systems, Industrial | |
| Fastening Type | Threaded | |
| Current Rating (Amps) | - | |
| Orientation | D | |
| Shielding | Shielded | |
| Ingress Protection | Environment Resistant | |
| Shell Finish | Electroless Nickel | |
| Shell Size - Insert | 17-99 | |
| Speed | 1.4GHz | |
| RAM Size | 256KB | |
| Shell Size, MIL | - | |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | |
| Peripherals | DMA, WDT | |
| Connectivity | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
| Cable Opening | - | |
| Architecture | MPU, FPGA | |
| Primary Attributes | FPGA - 1.2M Logic Elements | |
| Flash Size | - | |
| Features | Hermetically Sealed | |
| Contact Finish Thickness - Mating | - | |
| Material Flammability Rating | - |
Index :
0123456789ABCDEFGHIJKLMNOPQRSTUVWXYZ



