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AGFA019R25A2E3E Tech Specifications
Intel AGFA019R25A2E3E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Mounting Type | Through Hole | |
| Package / Case | Radial, Disc | |
| Supplier Device Package | - | |
| Package | Bulk | |
| Mfr | Vishay Beyschlag/Draloric/BC Components | |
| Product Status | Active | |
| Voltage Rated | 440VAC | |
| Number of I/Os | 480I/Os | |
| Operating Temperature | -40°C ~ 125°C | |
| Series | WYO | |
| Size / Dimension | 0.256 Dia (6.50mm) | |
| Tolerance | ±20% | |
| Temperature Coefficient | Y5U (E) | |
| Applications | Safety | |
| Capacitance | 1000 pF | |
| Failure Rate | - | |
| Lead Spacing | 0.197 (5.00mm) | |
| Speed | 1.4GHz | |
| RAM Size | 256KB | |
| Lead Style | Straight | |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | |
| Peripherals | DMA, WDT | |
| Connectivity | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
| Architecture | MPU, FPGA | |
| Primary Attributes | FPGA - 1.9M Logic Elements | |
| Flash Size | - | |
| Features | - | |
| Height Seated (Max) | 0.374 (9.50mm) | |
| Thickness (Max) | - | |
| Ratings | X1, Y2 |
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