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AGFA008R16A2E2V Tech Specifications

Intel  AGFA008R16A2E2V technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Free Hanging (In-Line)
Package / Case -
Mounting Feature -
Shell Material Aluminum
Supplier Device Package -
Insert Material -
Backshell Material, Plating -
Contact Materials Copper Alloy
Contact Finish Mating Gold
Product Status Active
Mfr Amphenol Aerospace Operations
Base Product Number MS27467E25B
Primary Material Metal
Package Bulk
Voltage, Rating -
Number of I/Os 384I/Os
Series Military, MIL-DTL-38999 Series I, LJT
Operating Temperature -65°C ~ 175°C
Termination Crimp
Connector Type Plug, Male Pins
Number of Positions 19Positions
Color Olive Drab
Applications Aviation, Military
Fastening Type Bayonet Lock
Current Rating (Amps) -
Orientation A
Shielding Shielded
Ingress Protection Environment Resistant
Shell Finish Olive Drab Cadmium over Nickel
Shell Size - Insert 25-19
Speed 1.4GHz
RAM Size 256KB
Shell Size, MIL -
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Cable Opening -
Architecture MPU, FPGA
Primary Attributes FPGA - 764K Logic Elements
Flash Size -
Features Coupling Nut
Contact Finish Thickness - Mating 50.0µin (1.27µm)
Material Flammability Rating -
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