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89TTM552BL Tech Specifications

IDT  89TTM552BL technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 960Terminals
Reflow Temperature-Max (s) 30
Supply Voltage-Nom 1.8 V
Supply Voltage-Max 1.89 V
Package Style GRID ARRAY
Package Shape SQUARE
Package Code BGA
Package Body Material PLASTIC/EPOXY
Operating Temperature-Max 85 °C
Risk Rank 5.66
Package Description 35 X 35 MM, 1 MM PITCH, FPBGA-960
Part Package Code BGA
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC
Part Life Cycle Code Obsolete
Rohs Code No
Manufacturer Part Number 89TTM552BL
Supply Voltage-Min 1.71 V
JESD-609 Code e0
ECCN Code 5A991
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Reach Compliance Code not_compliant
Pin Count 960
JESD-30 Code S-PBGA-B960
Qualification Status Not Qualified
Temperature Grade OTHER
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Seated Height-Max 3.29 mm
Width 35 mm
Length 35 mm
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