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82P2916BFG Tech Specifications
IDT 82P2916BFG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 17 Weeks | |
| Contact Plating | Copper, Silver, Tin | |
| Mount | Surface Mount | |
| Package / Case | BGA | |
| Number of Pins | 484Pins | |
| Power Dissipation (Max) | 3.1W | |
| Published | 2010 | |
| JESD-609 Code | e1 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Number of Terminations | 484Terminations | |
| ECCN Code | EAR99 | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Max Operating Temperature | 85°C | |
| Min Operating Temperature | -40°C | |
| HTS Code | 8542.39.00.01 | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Number of Functions | 1Function | |
| Supply Voltage | 1.8V | |
| Terminal Pitch | 0.8mm | |
| Pin Count | 484 | |
| Power Supplies | 1.83.3V | |
| Temperature Grade | INDUSTRIAL | |
| Number of Circuits | 16Circuits | |
| Telecom IC Type | INTERFACE CIRCUIT | |
| Length | 19mm | |
| Height Seated (Max) | 1.7mm | |
| Width | 19mm | |
| Thickness | 1.76mm | |
| Radiation Hardening | No | |
| RoHS Status | RoHS Compliant | |
| Lead Free | Lead Free |
82P2916BFG Documents
Download datasheets and manufacturer documentation for 82P2916BFG
- Datasheets82p2916bfg-DMAtNw9j-nZ8nn2yow.pdf
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