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XC2299H200F100LABKXUMA1 Tech Specifications

Infineon  XC2299H200F100LABKXUMA1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 26 Weeks
Mounting Type Surface Mount
Package / Case 176-LQFP Exposed Pad
Surface Mount YES
Number of Pins 176Pins
Data Converters A/D 30x10b
Number of I/Os 150I/Os
Watchdog Timers Yes
Operating Temperature -40°C~125°C TA
Packaging Tape & Reel (TR)
Series XC22xxH
Published 2001
JESD-609 Code e3
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 176Terminations
ECCN Code 3A991.A.2
Terminal Finish Tin (Sn)
Max Power Dissipation 1W
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Frequency 100MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number SA*XC2299H
Interface CAN, EBI/EMI, I2C, I2S, LIN, SPI, UART, USART
Memory Size 1.6MB
Oscillator Type Internal
RAM Size 138K x 8
Voltage - Supply (Vcc/Vdd) 3V~5.5V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Core Processor C166SV2
Peripherals DMA, I2S, POR, PWM, WDT
Program Memory Type FLASH
Core Size 16/32-Bit
Program Memory Size 1.6MB 1.6M x 8
Connectivity CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Bit Size 32
Has ADC YES
DMA Channels NO
PWM Channels YES
Halogen Free Halogen Free
DAC Channels NO
Number of Timers/Counters 5Timers/Counters
Address Bus Width 24
External Data Bus Width 16
Length 24mm
Height Seated (Max) 1.6mm
Width 24mm
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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