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TC277TP64F200NDCKXUMA1 Tech Specifications

Infineon  TC277TP64F200NDCKXUMA1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 26 Weeks
Mounting Type Surface Mount
Package / Case 292-LFBGA
Surface Mount YES
Data Converters A/D 60x12b, 6 x Sigma-Delta
Number of I/Os 169I/Os
Operating Temperature -40°C~125°C TA
Packaging Tape & Reel (TR)
Series AURIX™
Published 2010
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 292Terminations
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Frequency 200MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B292
Interface CAN, Ethernet, I2C, LIN, SPI
Memory Size 4MB
Oscillator Type External
RAM Size 472K x 8
Voltage - Supply (Vcc/Vdd) 3V~5.5V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Core Processor TriCore™
Peripherals DMA, WDT
Program Memory Type FLASH
Core Size 32-Bit Tri-Core
Program Memory Size 4MB 4M x 8
Connectivity ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Bit Size 32
Has ADC YES
DMA Channels YES
Data Bus Width 32b
PWM Channels NO
EEPROM Size 64K x 8
On Chip Program ROM Width 8
Number of A/D Converters 8A/D Converters
Number of ADC Channels 60ADC Channels
Max Junction Temperature (Tj) 150°C
Ambient Temperature Range High 125°C
Number of SPI Channels 4SPI Channels
Number of Ethernet Channels 1Ethernet Channel
Height 1.7mm
RoHS Status ROHS3 Compliant
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