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TC275TP64F200NDCKXUMA1 Tech Specifications

Infineon  TC275TP64F200NDCKXUMA1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 26 Weeks
Mounting Type Surface Mount
Package / Case 176-LQFP Exposed Pad
Surface Mount YES
Data Converters A/D 40x12b, 6 x Sigma-Delta
Number of I/Os 112I/Os
Operating Temperature -40°C~125°C TA
Packaging Tape & Reel (TR)
Series AURIX™
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 176Terminations
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Pitch 0.5mm
Frequency 200MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Interface CAN, Ethernet, I2C, LIN, SPI
Memory Size 4MB
Oscillator Type External
RAM Size 472K x 8
Voltage - Supply (Vcc/Vdd) 3V~5.5V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Core Processor TriCore™
Peripherals DMA, WDT
Program Memory Type FLASH
Core Size 32-Bit Tri-Core
Program Memory Size 4MB 4M x 8
Connectivity ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Bit Size 32
Has ADC YES
DMA Channels YES
Data Bus Width 32b
PWM Channels NO
EEPROM Size 64K x 8
On Chip Program ROM Width 8
Number of A/D Converters 8A/D Converters
Number of ADC Channels 60ADC Channels
Max Junction Temperature (Tj) 150°C
Ambient Temperature Range High 125°C
Number of SPI Channels 4SPI Channels
Number of Ethernet Channels 1Ethernet Channel
Height 1.6mm
RoHS Status ROHS3 Compliant
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TC275TP64F200NDCKXUMA1 Documents

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