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TC233LP32F200NACKXUMA1 Tech Specifications

Infineon  TC233LP32F200NACKXUMA1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 26 Weeks
Mounting Type Surface Mount
Package / Case 100-TQFP Exposed Pad
Surface Mount YES
Data Converters A/D 24x12b
Number of I/Os 78I/Os
RAM(byte) 196608
Operating Temperature -40°C~125°C TA
Packaging Tape & Reel (TR)
Series AURIX™
Published 2017
JESD-609 Code e4
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 100Terminations
ECCN Code 3A001.A.3
Terminal Finish Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED
Frequency 200MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PQFP-G100
Interface CAN, LIN, SPI
Memory Size 2MB
Oscillator Type External
RAM Size 192K x 8
Voltage - Supply (Vcc/Vdd) 3.3V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Core Processor TriCore™
Peripherals DMA, WDT
Program Memory Type FLASH
Core Size 32-Bit
Program Memory Size 2MB 2M x 8
Connectivity CANbus, FlexRay, LINbus, QSPI
Bit Size 32
Has ADC YES
DMA Channels YES
Data Bus Width 32b
PWM Channels NO
EEPROM Size 128K x 8
On Chip Program ROM Width 8
Number of A/D Converters 2A/D Converters
Number of ADC Channels 24ADC Channels
Max Junction Temperature (Tj) 150°C
Ambient Temperature Range High 125°C
Number of SPI Channels 4SPI Channels
Height 1.2mm
RoHS Status ROHS3 Compliant
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