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TC233LP32F200FACKXUMA1 Tech Specifications

Infineon  TC233LP32F200FACKXUMA1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 32 Weeks
Mounting Type Surface Mount
Package / Case 100-TQFP Exposed Pad
Supplier Device Package 100-TQFP (12x12)
Data Converters A/D 24x12b
Number of I/Os 78I/Os
Operating Temperature -40°C~125°C TA
Packaging Tape & Reel (TR)
Series AURIX™
Published 2017
Part Status Discontinued
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Oscillator Type External
Speed 200MHz
RAM Size 192K x 8
Voltage - Supply (Vcc/Vdd) 3.3V
Core Processor TriCore™
Peripherals DMA, WDT
Program Memory Type FLASH
Core Size 32-Bit
Program Memory Size 2MB 2M x 8
Connectivity CANbus, FlexRay, LINbus, QSPI
EEPROM Size 128K x 8
RoHS Status ROHS3 Compliant
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TC233LP32F200FACKXUMA1 Documents

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