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HYB18T512800BF-3S Tech Specifications

Infineon  HYB18T512800BF-3S technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 60Terminals
Manufacturer Part Number HYB18T512800BF-3S
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer QIMONDA AG
Part Package Code BGA
Package Description TFBGA, BGA60,9X11,32
Risk Rank 8.48
Access Time-Max 0.45 ns
Clock Frequency-Max (fCLK) 333 MHz
Moisture Sensitivity Levels 3
Number of Words 67108864 wordsWord
Number of Words Code 64000000Words Codes
Operating Temperature-Max 95 °C
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA60,9X11,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Supply Voltage-Nom (Vsup) 1.8 V
Reflow Temperature-Max (s) 40
ECCN Code EAR99
Additional Feature AUTO/SELF REFRESH
HTS Code 8542.32.00.28
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Terminal Pitch 0.8 mm
Reach Compliance Code unknown
Pin Count 60
JESD-30 Code R-PBGA-B60
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.9 V
Power Supplies 1.8 V
Temperature Grade OTHER
Supply Voltage-Min (Vsup) 1.7 V
Number of Ports 1Port
Operating Mode SYNCHRONOUS
Supply Current-Max 0.152 mA
Organization 64MX8
Output Characteristics 3-STATE
Seated Height-Max 1.2 mm
Memory Width 8
Standby Current-Max 0.007 A
Memory Density 536870912 bit
I/O Type COMMON
Memory IC Type DDR DRAM
Refresh Cycles 8192
Sequential Burst Length 4,8
Interleaved Burst Length 4,8
Access Mode FOUR BANK PAGE BURST
Self Refresh YES
Length 10.5 mm
Width 10 mm
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HYB18T512800BF-3S Documents

Download datasheets and manufacturer documentation for   HYB18T512800BF-3S

  • Datasheets
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