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BSL207NH6327XTSA1 Tech Specifications

Infineon  BSL207NH6327XTSA1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 12 Weeks
Mount Surface Mount
Package / Case SOT-23-6 Thin, TSOT-23-6
Mounting Type Surface Mount
Number of Pins 6Pins
Transistor Element Material SILICON
Number of Elements 2 Elements
Published 2013
Series Automotive, AEC-Q101, OptiMOS™
Packaging Tape & Reel (TR)
Operating Temperature -55°C~150°C TJ
JESD-609 Code e3
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 6Terminations
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Additional Feature AVALANCHE RATED
Max Power Dissipation 500mW
Terminal Form GULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Configuration SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
Operating Mode ENHANCEMENT MODE
Power - Max 500mW
FET Type 2 N-Channel (Dual)
Rds On (Max) @ Id, Vgs 70m Ω @ 2.1A, 4.5V
Vgs(th) (Max) @ Id 1.2V @ 11μA
Halogen Free Halogen Free
Input Capacitance (Ciss) (Max) @ Vds 419pF @ 10V
Gate Charge (Qg) (Max) @ Vgs 2.1nC @ 4.5V
Rise Time 2.8ns
Continuous Drain Current (ID) 2.1A
Gate to Source Voltage (Vgs) 12V
Max Dual Supply Voltage 20V
Drain-source On Resistance-Max 0.07Ohm
FET Technology METAL-OXIDE SEMICONDUCTOR
FET Feature Logic Level Gate, 2.5V Drive
Feedback Cap-Max (Crss) 24 pF
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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