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- BGSA11GN10E6327XTSA1
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BGSA11GN10E6327XTSA1 Tech Specifications
Infineon BGSA11GN10E6327XTSA1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 8 Weeks | |
| Package / Case | 10-XFQFN Exposed Pad | |
| Surface Mount | YES | |
| Operating Temperature | -30°C~85°C | |
| Packaging | Tape & Reel (TR) | |
| Published | 2015 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 10Terminations | |
| HTS Code | 8542.39.00.01 | |
| Voltage - Supply | 1.8V~3.6V | |
| Terminal Position | BOTTOM | |
| Terminal Form | BUTT | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Supply Voltage | 2.85V | |
| Terminal Pitch | 0.4mm | |
| Frequency | 5GHz | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| JESD-30 Code | R-XBCC-B10 | |
| Circuit | SPST | |
| Test Frequency | 2.69GHz | |
| Impedance | 50Ohm | |
| Frequency Range | 100MHz~5GHz | |
| Insertion Loss | 0.35dB | |
| Telecom IC Type | TELECOM CIRCUIT | |
| Isolation | 14dB | |
| RF Type | General Purpose | |
| IIP3 | 75dBm | |
| Length | 1.5mm | |
| Height Seated (Max) | 0.4mm | |
| Width | 1.1mm | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
BGSA11GN10E6327XTSA1 Documents
Download datasheets and manufacturer documentation for BGSA11GN10E6327XTSA1
- DatasheetsBGSA11GN10E6327XTSA1-Infineon-datasheet-82520592.pdf BGSA11GN10E6327XTSA1-Infineon-datasheet-62115270.pdf BGSA11GN10E6327XTSA1-Infineon-datasheet-86815070.pdf
- PCN PackagingMult Dev Packing Box Chg 18/Oct/2019
- Other Related DocumentsPart Number Guide
- ConflictMineralStatementInfineon-company-51.pdf
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