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BGS18MN14E6327XTSA1 Tech Specifications
Infineon BGS18MN14E6327XTSA1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
Factory Lead Time | 10 Weeks | |
Package / Case | 14-WFQFN Exposed Pad | |
Surface Mount | YES | |
Operating Temperature | -30°C~85°C | |
Packaging | Tape & Reel (TR) | |
Published | 2014 | |
JESD-609 Code | e3 | |
Part Status | Active | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Number of Terminations | 14Terminations | |
Terminal Finish | Tin (Sn) | |
HTS Code | 8542.39.00.01 | |
Voltage - Supply | 2.5V~5.5V | |
Terminal Position | QUAD | |
Terminal Form | NO LEAD | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Number of Functions | 1Function | |
Supply Voltage | 3.5V | |
Terminal Pitch | 0.5mm | |
Frequency | 2.7GHz | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
JESD-30 Code | S-PQCC-N14 | |
Circuit | SP8T | |
Test Frequency | 2GHz | |
Impedance | 50Ohm | |
Halogen Free | Halogen Free | |
Frequency Range | 100MHz~2.7GHz | |
Insertion Loss | 0.8dB | |
Telecom IC Type | TELECOM CIRCUIT | |
Isolation | 29dB | |
Insertion Loss (dB) | 0.35 dB | |
RF Type | LTE, W-CDMA | |
Length | 2mm | |
Height Seated (Max) | 0.77mm | |
Width | 2mm | |
RoHS Status | ROHS3 Compliant | |
Lead Free | Lead Free |
BGS18MN14E6327XTSA1 Documents
Download datasheets and manufacturer documentation for BGS18MN14E6327XTSA1
- DatasheetsBGS18MN14
- Other Related DocumentsPart Number Guide
- PCN PackagingCarrier Tape Pocket Chg 10/Nov/2016 Mult Dev Packing Box Chg 18/Oct/2019
- Simulation ModelsInfineon-BGS18MN14_S-parameter-SM-v01_00-EN Spice Model
- ConflictMineralStatementInfineon-company-51.pdf
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