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BGS18GA14E6327XTSA1 Tech Specifications
Infineon BGS18GA14E6327XTSA1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 12 Weeks | |
| Package / Case | 14-UFQFN Exposed Pad | |
| Surface Mount | YES | |
| Operating Temperature | -30°C~85°C | |
| Packaging | Tape & Reel (TR) | |
| Published | 1997 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 14Terminations | |
| HTS Code | 8542.39.00.01 | |
| Voltage - Supply | 3V | |
| Terminal Position | QUAD | |
| Terminal Form | BUTT | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Supply Voltage | 3V | |
| Frequency | 3.8GHz | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| JESD-30 Code | S-XQMA-B14 | |
| Circuit | SP8T | |
| Test Frequency | 3.5GHz | |
| Impedance | 50Ohm | |
| Frequency Range | 100MHz~3.8GHz | |
| Insertion Loss | 0.7dB | |
| Telecom IC Type | TELECOM CIRCUIT | |
| Isolation | 33dB | |
| Length | 2mm | |
| Height Seated (Max) | 0.65mm | |
| Width | 2mm | |
| RoHS Status | ROHS3 Compliant |
BGS18GA14E6327XTSA1 Documents
Download datasheets and manufacturer documentation for BGS18GA14E6327XTSA1
- DatasheetsBGS18GA14
- PCN PackagingMult Dev Packing Box Chg 18/Oct/2019
- Other Related DocumentsPart Number Guide
- ConflictMineralStatementInfineon-company-51.pdf
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