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- BGS13S2N9E6327XTSA1
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BGS13S2N9E6327XTSA1 Tech Specifications
Infineon BGS13S2N9E6327XTSA1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 6 Weeks | |
| Package / Case | 9-XFLGA | |
| Surface Mount | YES | |
| Operating Temperature | -40°C~85°C | |
| Packaging | Tape & Reel (TR) | |
| Published | 2016 | |
| Pbfree Code | yes | |
| Part Status | Obsolete | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 9Terminations | |
| HTS Code | 8542.39.00.01 | |
| Voltage - Supply | 1.8V~3.3V | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Supply Voltage | 3V | |
| Terminal Pitch | 0.4mm | |
| Frequency | 3GHz | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| JESD-30 Code | S-XBGA-B9 | |
| Circuit | SP3T | |
| Impedance | 50Ohm | |
| Frequency Range | 100MHz~3GHz | |
| Insertion Loss | 0.55dB | |
| Telecom IC Type | TELECOM CIRCUIT | |
| Isolation | 23dB | |
| Length | 1.1mm | |
| Height Seated (Max) | 0.4mm | |
| Width | 1.1mm | |
| RoHS Status | RoHS Compliant |
BGS13S2N9E6327XTSA1 Documents
Download datasheets and manufacturer documentation for BGS13S2N9E6327XTSA1
- DatasheetsBGS13S2N9
- Other Related DocumentsPart Number Guide
- PCN Obsolescence/ EOLBGS 13S2N9 E6327 EOL 6/Feb/2018
- ConflictMineralStatementInfineon-company-51.pdf
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